Gripping Power logo

Application Notes

Plasma Effects on Electrostatic Chuck Characteristics on Capacitive RF Discharge
G. Shim, T. Yamauchi and H. Sugai, Toshiba Corporation (2008)

Dechuck Operation of Coulomb Type and Johnsen-Rahbek Type of Electrostatic Chuck Used in Plasma Processing
G. Shim and H. Sugai, Nagoya University (2008)

Comparison of Comparison of Coulombic and Johnsen-Rahbek Electrostatic Chucking for EUV Lithography
M. R. Sogard, Nikon Research Corporation of America, Belmont, CA (2007)

The inclusion of a publication, reference to an individual, business or research organization does not imply an endorsement or association with Gripping Power, Inc.