Plasma Effects on Electrostatic Chuck Characteristics on Capacitive RF Discharge
G. Shim, T. Yamauchi and H. Sugai, Toshiba Corporation (2008)
Dechuck Operation of Coulomb Type and Johnsen-Rahbek Type of Electrostatic Chuck Used in Plasma Processing
G. Shim and H. Sugai, Nagoya University (2008)
Comparison of Comparison of Coulombic and Johnsen-Rahbek Electrostatic Chucking for EUV Lithography
M. R. Sogard, Nikon Research Corporation of America, Belmont, CA (2007)
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